Cluster alliance set to advance Epson inkjet tech

Seiko Epson Corporation and Cluster Technology Co., Ltd. have entered into a capital and business alliance agreement, through which the companies plan to better leverage their respective technologies and expertise in the development of high-performance components and advanced materials, including components related to inkjet printheads. Cluster Technology has been leveraging the precision molding and customised material technologies of its nano- and micro-technology business to accelerate the replacement of metal parts and other materials with plastic parts in precision products such as optical equipment and printers. Doing so allows the company to reduce product weight, enhance performance, and lower manufacturing costs. In its macro-technology business, Cluster Technology has compiled an extensive track record in plastic insulating materials for the heavy electrical equipment industry, electrical insulation structures for power distribution systems, and plastic-molded insulators. In this way, the company has supported improvements in the safety and reliability of industrial infrastructure for many years.

Meanwhile, Epson, operating in line with a long-term vision outlined in its ENGINEERED FUTURE 2035 strategy, seeks to solve societal issues and create new value by leveraging its efficient, compact, and precise technology and philosophy to drive innovation in co-creation projects with partners. Inkjet printheads are the core technology underpinning Epson’s Inkjet Solutions business, which Epson has positioned as a growth domain. The company plans to invest approximately ¥5 billion over a three-year period to promote investments and collaborative development initiatives aimed at advancing technological innovation and creating new business opportunities. By combining the strengths of both companies, Epson and Cluster Technology aim to advance the development of inkjet printhead components and material technologies, further enhancing inkjet technology and expanding its application into new fields. (Photo Credit: Wide Format Image)   

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